Feb 04 2008

Intel Launches Tukwila, the First Chip to Pack More than Two Billion Transistors

Intel Launches Tukwila, the First Chip to Pack More than Two Billion TransistorsIntel Launches Tukwila, the First Chip to Pack More than Two Billion TransistorsFeb 04, `08 — The first chip to pack more than two billion transistors has been launched by silicon giant Intel. The quad-core chip, known as Tukwila, is designed for high-end servers rather than personal computers.

It operates at speeds of up to 2Ghz, the equivalent of a standard PC chip. A large number of the transistors on the new Intel chip are used for memory. “[It] contains lots off onboard memory and registers which are just a very efficient computer architecture to process data faster. Cache memory holds data to be processed by the chip. The closer it is to the processor, the quicker the data can be crunched.

Intel will also show off a chip designed for ultra-mobile devices, known as Silverthorne. The processor is based on the firms latest transistor technology which contains features just 45 nanometers (billionth of a meter) wide.

Both chips will be shown off at the International Solid State Circuits Conference (ISSCC) in San Francisco.


Feb 04 2008

AMD to Display Triple-cores at CeBIT 2008, Again Delays Faster Quad-cores

AMD to Display Triple-cores at CeBIT 2008, Again Delays Faster Quad-coresTaipei, Taiwan — Feb 04, `08 — AMD expects to launch its triple-core Phenom 8400 and 8600 at CeBIT 2008 along with its low-power quad-core Phenom 9100e, however the quad-core Phenom 9700 and 9900 CPUs, which were originally scheduled to launch at the same time, will be delayed for both launch and showcase to a later time, DigiTimes reports citing sources at motherboard makers.

DigiTimes further writes, “The delay of Phenom 9700 and 9900 is due to the TLB bug and AMD is still working to raise core frequencies. The company will launch Phenom 9550 and 9650 in the second quarter this year.

AMD will also delay the launch of its second wave triple-core Phenom 8700, 8650 and 8450 CPUs by a month, from their original schedule in early second quarter.” More at DigiTimes.


Jan 07 2008

Intel Unveils 16 Next-Generation Processors, Including First Notebook Chips Built on 45nm Technology

Intel Unveils 16 Next-Generation Processors, Including First Notebook Chips Built on 45nm TechnologyCES 2008 — Las Vegas — Jan 07, `08 — Intel unveiled 16 products today, including the company’s first 45 nanometer (nm) processors for Intel Centrino Processor Technology based laptops.

With the introduction of the new processors, Intel will offer 32 desktop, laptop and server processors based on these innovations. Intel also announced continuing momentum in ultra mobile computing and WiMAX.

Mobility: Intel Announces Santa Rosa Refresh Product Line
Santa Rosa Refresh – Intel launched “Santa Rosa Refresh,” an update to Intel Centrino processor technology that includes the next-generation 45nm high-k (Hi-k) mobile processor (codenamed “Penryn”) and improved graphics capabilities.

• 45nm Hi-k Intel Core 2 Duo mobile processor for Centrino — Taking advantage of the Hafnium-based, Hi-k metal gate reinvented transistors inside, Santa Rosa Refresh-based notebooks deliver improved platform performance and great battery life. Graphics improvement focuses on HD DVD and Blu-ray Disc support with an optional third-party decoder, as well as enhanced content and gaming capabilities.
• Santa Rosa Refresh for Desktop — Intel will also use this new mobile technology foundation with the energy-efficient performance of the 45nm Intel Core 2 Duo processor to enable a variety of smaller, cooler and quieter, stylish desktop designs.

Intel Unveils 16 Next-Generation Processors, Including First Notebook Chips Built on 45nm Technology

Mobile Internet Devices:
• Intel confirms “Menlow” platform shipments in the first half of 2008: Intel is getting ready to ship its first-generation low-power platform, codenamed “Menlow,” in the first half of the year. The Menlow platform is comprised of the “Silverthorne” processor and the “Poulsbo” chipset, both being designed from the ground up for MIDs and UMPCs. At CES, Intel provided a sneak peek of some of the upcoming “Menlow”-based devices and applications that are being optimized for this platform.
• Intel unveils customers planning to launch Menlow-based platforms at CES: In a sign of growing momentum behind MIDs and UMPCs, Intel is showcasing a range of Menlow-based devices from customers who expect to ship these products later this year. In its technology showcase, Intel has Menlow-based MIDs and UMPCs from Aigo, Asus, BenQ, Clarion, Compal, Digifriends, EB, Gigabyte, Lenovo, LG-E, LiteOn, Quanta, Toshiba, USI, and Willcom.
• Skype announces support for Intel-based MIDs: Skype announced a collaboration with Intel to develop a mobile Skype experience for MIDs based on Intel low power processors and chipsets. Mobile users will be able to make Skype voice and video calls and send instant messages on the move while harnessing the PC-like performance of Intel’s MIDs. This new category of small, truly mobile consumer devices with WiMAX and Wi-Fi capabilities will enable free Skype-to-Skype voice and video calls and cheap SkypeOut calls to be made on open wireless networks.

WiMAX: Mobile WiMAX Takes the Stage in 2008
Intel’s integrated Wi-Fi/WiMAX module (codenamed “Echo Peak”) will debut in certain next-generation Intel Centrino processor-based laptops (codenamed “Montevina”) beginning in the middle of the year. The company’s low-power mobile WiMAX silicon specifically designed for mobile Internet and consumer electronic devices (codenamed “Baxter Peal”) will also be available this year.

Consumer Desktop PCs: 45nm Goes Mainstream this Quarter
• “Penryn” family of processors comes to mainstream desktop PCs – Intel announced three quad-core and four dual-core 45nm-based processors for consumer desktop PCs arriving later this month and throughout the first quarter of the year. The new 45nm Intel Core 2 Quad and Intel Core 2 Duo processors have a range of speeds and feature large L2 caches and Intel HD Boost, which delivers increased performance on such multimedia applications as video editing and encoding.
• Intel Core 2 Processor with Viiv technology – Intel will also extend the performance and energy efficiency of the new 45nm processors with Intel HD Boost to the Intel Core 2 Processor with Viiv technology platform. The company will also focus future plans on delivering silicon-driven capabilities that support the areas of better connecting, protecting and managing digital content – as well as delivering the performance required to view, share and enjoy it.

Intel Unveils 16 Next-Generation Processors, Including First Notebook Chips Built on 45nm Technology

• Later this quarter:
– The Intel Core 2 Extreme QX9770 Processor (3.2 GHz/1600 MHz system bus 45nm Hi-k metal gate processor formerly codenamed “Yorkfield”) and Intel X48 Express Chipset targeted at high-end PC users and enthusiasts. The Intel X48 Express Chipset continues to push the performance envelope with native support for XMP 1600 DDR3 memory.
– “Skulltrail” is a new dual processor-based platform that will provide extreme high-end enthusiasts with a fantastic professional media creation and gaming experience. The platform will feature two quad-core Intel Core 2 Extreme processors for 8-core performance and 4 PCI Express x16 Gen 1.1 slots with planned support for up to 4 graphics cards. More at Intel (in pdf).


Dec 25 2007

AMD to Launch Triple-Core Phenom CPUs in March 2008

AMD to Launch Triple-Core Phenom CPUs in March 2008Dec 25, `07 — DigiTimes is reporting on AMD adjusting its triple-core CPU model numbers and launch dates, citing sources at motherboard makers.

“AMD will launch two B2 stepping triple-core CPUs, Phenom 8600 and 8400 in March of next year, while in the second quarter, the company will launch three more models, Phenom 8700, 8650 and 8450.

The Phenom 8400 and 8600 will feature core frequencies of 2.1GHz and 2.3GHz, respectively, while the Phenom 8700 will clock at 2.4GHz. Phenom 8650 and 8450 will be based on B3 stepping cores, and will have frequencies of 2.3GHz and 2.1GHz, respectively. All five CPUs will have a 95W TDP.

The high price/performance ratio of the triple-core CPUs could force Intel to cut prices of its quad-core products which could cause higher-end models to cut into sales of lower-end CPUs, noted the sources. However, AMD could also face the same problem, they added.” More at DigiTimes.


Dec 24 2007

AMD to Further Delay Phenom 9700, 9900 Launch

AMD to Further Delay Phenom 9700, 9900 LaunchDec 24, `07 — DigiTimes is reporting on AMD notifying its partners that the launch of higher-end quad-core Phenom processors, including the 9700 and 9900, will be postponed to the second quarter of 2008 from the original schedule of early 2008, citing sources at motherboard makers.

“However, whether AMD’s triple-core Toliman series CPUs will also see delay will be the key decision for the company, since Toliman offers a high price/performance ratio compared with Intel’s quad-core CPUs. A delay for Toliman will hurt AMD the most, noted the sources.

The sources commented that the reason for the delay of 9700 and 9900 is because AMD has not yet been able to solve the translation lookaside buffer (TLB) erratum found in the chips.” More at DigiTimes.


Dec 19 2007

MSI Announces - 45nm CPU and 3-Way SLI Ready - 780i, 750i Motherboards

MSI Announces - 45nm CPU and 3-Way SLI Ready - 780i, 750i MotherboardsTaipei, Taiwan — On Dec 17, Micro-Star International (MSI) announced that it has already prepared P7N Diamond and P7N SLI Platinum mainboards to support the 45nm Intel processor at the same time when new nForce chipset launches.

P7N Diamond utilizes nForce780i chipset together with top performance specifications and supports 3-way SLI technology. While, P7N SLI Platinum utilizes nForce750i chipset, making this mainboard cost-effective.

Highly Efficient Circu-Pipe and GreenPower Design
The use of selected high-grade components is the common characteristic of the P7N series mainboards. Although the two mainboards have different market segments, they both come with MSI’s exclusive Circu-Pipe design. Circu-pipe can effectively reduce the high temperature from the chipset and MOSFET.

Selected high-quality solid capacitors and POSCAP!
The all capacitors on these two mainboards are high-quality solid capacitors that are made in Japan. These capacitors with low impedance and high ripple current and other characteristics provide better filtering effect. To further highlight P7N Diamond products, the PWM capacitors on this mainboard are based on POSCAP. POSCAP (Polymerized Organic Semiconductor Capacitor) is a high grade product recently developed by Sanyo.

45nm Processor and 3-way SLI ready!
P7N series mainboards are Intel 45nm processor and 3-way SLI ready. The 45nm Quad Core CPU support brings more benefits to multimedia and multitasking by enhancing the performance and reducing the waiting time for any kind of applications. It provides extremely high definition audio/video stream editing and offers higher performance on 3D gaming and professional graphic rendering.

MSI design quad PCI-E VGA slot on P7N Diamond for more than the new Nvidia 3-way SLI technology, also comes with PCI-E Gen2 to offer wider bandwidth. This will bring higher 3D gaming resolutions with more detail DX10 effects. More at Micro-Star International.


Dec 19 2007

Intel to Delay Three Quad-Core Penryns Till AMD Releases Phenoms

Intel to Delay Three Quad-Core Penryns Till AMD Releases Phenoms

Taipei, Taiwan — Dec 19, `07 — DigiTimes brings us another Intel launch-delay news, just 2 days after Intel’s X48 chipset postponement.

DigiTimes reports on Intel adjusting its product strategy and delaying three 45nm quad-core CPUs, Core 2 Quad Q9300, Q9450 and Q9550, that were originally scheduled to launch in January next year, citing sources at motherboard makers.

“Intel has already notified its partners that it will push back the launch of the three CPUs to February or March next year, depending on AMD’s schedule for triple-core and the upcoming Phenom CPUs.

Launching the CPUs now will not benefit Intel much in its battle with AMD, while they could cause damage to Intel’s 65nm quad-core CPUs, therefore the company has decided it is in no rush to release new products until AMD is able to present more of a threat.” More at DigiTimes.


Dec 06 2007

Intel to Release New Celeron E1000, Dual & Quad Cores on January 20

Intel to Release New Celeron E1000, Dual & Quad Cores on January 20Taipei, Taiwan — Dec 06, ‘07 — DigiTimes is reporting on Intel releasing its first desktop dual-core Celeron series, E1000, on January 20, citing sources at motherboard makers.

DigiTimes further writes, “The first dual-core Celeron processor, the E1200, will have core frequency of 1.6GHz, 800MHz FSB and 512KB L2 cache with a price of US$53 in thousand-unit quantities.

On the same day, Intel will also launch three quad-core (Yorkfield) CPUs, the Q9300, Q9450 and Q9550 and another four dual-core (Wolfdale) CPUs, the E8190, E8200, E8400 and E8500 for desktops, the motherboard makers added.”

Meanwhile, Intel will also roll out the quad-core QX9770 processor which features a frequency of 3.2GHz, 1600MHz FSB, 12MB cache and TDP of 136W with a price tag of US$1,399 in thousand-unit quantities in January. Before March, the company will also introduce a high-end quad-core QX9775 processor with a frequency of 3.2GHz, 1600MHz FSB, 12MB L2 cache and 150W TDP. Pricing in thousand-unit quantities will be US$1,499, said the DigiTimes sources. More at DigiTimes.


Dec 05 2007

Intel’s 45nm Penryn Mobile Processor to Launch on Jan 6

Intel’s 45nm Penryn Mobile Processor to Launch on Jan 6

Dec 05, ‘07 — DailyTech is reporting on Intel showing no signs of slowing down when it comes to its mobile processors.

“Intel will up the ante again on January 6, 2008 with its new 45nm Penryn-based Core 2 Duo and Core 2 Extreme dual core processors.

It’s highly plausible that the chips could make their first appearance at CES 2008 (January 7, 2008) with further unveils at MacWorld 2008 in Apple’s oft-rumored tablet, revamped MacBook Pros or refreshed iMac desktops.

Initial Penryn mobile processors will launch exclusively with a 35W thermal envelope. Existing Merom mobile processors (T7000-series) also fit inside the 35W envelope at standard voltage. However, with the Montevina Centrino refresh in the second half of 2008, new Penryn mobile processors will receive a 25W TDP rating instead.” More at DailyTech, Intel Laptop Roadmap (in pdf).


Nov 27 2007

Dell Ships Next-Gen WorkStations Dell Precision T7400, T5400

Tag: 45nm, Computers, Dell, Intel, Penryn, Quad Core, TechLuver, Work Stations, XeonJack @ 11:00 AM

Dell Ships Next-Gen WorkStations Dell Precision T7400, T5400Nov 27, ‘07 — Dell today introduced two new models of its Dell PrecisionM  workstations, the world’s top-selling line of professional workstations for the past eight years. Available today with prices starting at approximately $1,600 and $1,850 respectively, the Dell Precision T5400 and the Dell Precision T7400 provide the highest levels of performance and expandability available in a Dell workstation.

Dell will be the first tier-one vendor to ship workstations with the latest Quad-Core and Dual-Core Intel  Xeon  processors 5400 and 5200 series, using Intel’s latest 45-nm manufacturing process.

“These systems have some of the fastest Intel processors, high-end OpenGL graphics and massive scalability and memory capacities. In fact, we’ve designed configurations with an industry-leading 1600MHz front-side bus to help provide screaming performance,” said Antonio Julio, director worldwide marketing, Dell Precision workstations.

Key Features


• A dual-socket design supports up to two next-generation multi-core Intel Xeon processors. Dell offers some of the fastest Intel Xeon processors available, up to 3.2GHz. Multiple processor cores can increase application performance dramatically in multi-threaded and multi-tasking environments.

• Dual, full-performance PCI Express Gen2 x16 graphics slots providing up to double the maximum bandwidth of PCI Express x16. This enables customers to include up to two high-performance OpenGL®  graphics cards and support up to four 30-inch DellTM  UltraSharpTM  flat panel monitors at full resolution.

• The T5400/7400 uses a dual independent front-side bus design – up to 1333MHz on the T5400 and up to 1600MHz on the T7400 – to provide a fast data path between processors, memory and chipset, benefiting memory bandwidth-intensive applications.

• Both models use a fully buffered DIMM architecture with up to 800MHz front-side bus on the T7400, which will also support up to 128GB of system memory when 8GB DIMMs become available.

• Dell-engineered acoustic improvements make these systems up to 33 percent quieter than their predecessors.

• Designed with the environment in mind to meet or exceed the worldwide mutually recognized Environmental Protection Agency’s Energy Star Standard 4.0. Both models also use 80-plus percent efficient power supplies to reduce power consumption.

More at Dell.


Nov 16 2007

Cleaning Up in ‘Fab World’

Tag: 45nm, AMD, BBC, Intel, Processors, TechLuverJack @ 12:02 AM

Intel_Fab_32_Chandler_AZIntel_Fab_32_Chandler_AZ_InsideThe process of making silicon chips is as complex as the chips themselves. Each manufacturing plant, or “fab”, may cost billions of dollars and is a triumph of engineering.

Nov 15, ‘07 — Dr Peter Wilson, a Senior Lecturer in Electronics at the University of Southampton, School of Electronics and Computer Science, writes an in-depth article on “Fab World” for BBCNews. 

“Fab world” is like no other place on earth.

Its pristine white walls, secure air locks, sterile air and ethereal yellow lighting makes it seem like you have arrived in the belly of an orbiting space station.

Outside, we worry about dirt on our shoes and wipe our feet, or perhaps wipe some dust off our laptop screen. In fab world, we worry about a few atoms contaminating the environment.

If dust falls on the delicate silicon wafers on which chips are printed it can render them useless.

Modern transistors - the tiny switches at the heart of these devices - are described in terms of the smallest feature sizes that can be made, such as a 45 nanometres, or 45 billionths of a meter. To put this in perspective, the average human hair will be between 20 and 100 micrometers across - over a thousand times larger - and a typical dust particle will be anything from 1 to 100 micrometres.

The fab is a place for chips, not for people. As a result, only the pure and the clean are given permission to penetrate its’ inner chambers. Anyone that enters must go through a strict set of procedures.

A series of ante-chambers serve as prep rooms where workers change into a series of gowns and gloves, collectively known as a “bunny suit”.

Sticky floors make sure that no one treads in any contaminants and an air shower before entry makes certain that any loose particles are stripped away. Skin flakes, lint, hair and anything else gets sucked into the grate in the floor.

And then it’s onwards into the hum of the clean rooms. Stark white walls reflect the yellow sodium lights from above and a constant breeze blows down from the ceiling taking any particles through the gridded floor.

In modern fabs, ultra high tech chips are manufactured in what are known as class 1 rooms that contain just one tiny particle per metre cubed. In contrast, a room where open heart surgery takes place may have as many as 20,000.

Inside, humans very rarely come into contact with the rainbow-streaked discs of reflective silicon on which the chips are cut. Instead, they are there to trouble shoot and monitor that everything goes correctly. The silicon wafers are handled on monorails that move above the fab floor and the processing is done by complex vacuum sealed robots.

The wafers enter one end of the line costing a couple of hundred dollars and appear at the other - weeks later - patterned with billions of transistors and worth tens of thousands of pounds.

The silicon itself is not made at the fab - the ultra pure ingots (up to 99.99999999% pure) are produced and cut by specialist companies and sold to the chip makers. The fab world’s magic is creating the incredibly complex patterns of wires and circuitry on chips the size of a postage stamp time and time again

Each layer of a processor is constructed using a mask which is like a stencil, to highlight the areas to be deposited, etched or doped. Doping involves adding impurities to the silicon to change its electrical characteristics - something which has to be done with astonishing precision.

In addition, the size of individual features is now smaller than the wavelength of light that used to be used to pattern them, which means the use of some clever optics is required.

The yellowish lights used inside the fab are to make sure that they do not interfere with this process. Each one of the 10mm by 10mm silicon squares is a triumph of design. More at BBCNews.


Nov 14 2007

Qualcomm Introduces World’s 1st Single-chip 45nm Multi-mode Solutions for Mass-market Smartphones

QualcommNew Low-power QSC Solutions Offer Latest Modem Technologies, Multi-band Transceiver, High-performance Application Processor, Bluetooth, FM Radio and GPS in a 12mm x 12mm Package.

SAN DIEGO  —  November 13, 2007 — Qualcomm today introduced three new 45 nm single-chip solutions designed to enable mass-market smartphones with an unsurpassed range of capabilities. The QSC7230 for HSPA+ devices, QSC7830 for CDMA2000 1xEV-DO Rev. B devices, and multi-mode QSC7630 for both HSPA+ and EV-DO Rev. B, all feature the highest levels of integration in the wireless industry today and deliver support for third-party operating systems. These three single-chip solutions are the fifth generation of dual-core solutions from Qualcomm, comprising the next evolution of the Company’s MSM7xxx-series dual-core chipsets.

The products offer the most advanced cellular modem technologies, a multi-band RF transceiver supporting all frequency bands worldwide, an ARM11 application processor running up to 600 MHz, Bluetooth 2.1 EDR, FM radio and GPS - all in a single 12×12 package. Additionally, the three chipsets feature new power-saving innovations to deliver more than 80 hours of music playback, a full day of talk time, and more than a month of standby time.

The QSC7230 supports UMTS Release 7 (HSPA+) and Cat. 9 UMTS for 10.2 Mbps HSDPA and 5.76 Mbps HSUPA data speeds. The QSC7830 supports EV-DO Rev. B for up to 14.7 Mbps on the downlink and 5.4 Mbps on the uplink. The QSC7630 supports both EV-DO Rev. B and HSPA+. All three products feature full backward compatibility to previous-generation networks, as well as:

· ARM11 applications processor running at up to 600MHz
· Support for 5 megapixel camera, VGA display resolution and TV-out
· Support for third-party operating systems such as Windows Mobile and Linux
· 45 nm CMOS process technology
· 2D and 3D hardware-accelerated graphics
· Fully integrated GPS, FM radio and Bluetooth, eliminating the need for many external components
· Integrated support for worldwide cellular frequency bands

- For CDMA2000: 450MHz, 700MHz, 800MHz, J-800MHz, 850MHz, 1500MHz, AWS, KPCS 1.8GHz, 1.9GHz, 2.1GHz, 2.5GHz
- For UMTS: 700MHz, 800MHz, 850MHz, 900MHz, 1500MHz, AWS, 1800MHz, 1900MHz, 2.1MHz, 2.6GHz
- 4-band EGPRS support in 900MHz, 1800MHz, 850MHz, 1900MHz

· 12mm x 12mm package size

The QSC solutions are scheduled to sample in the fourth quarter of 2008.

Qualcomm Makes First Call with Chips Using TSMC’s 45 nm Technology

Qualcomm today also announced that it has made the first phone call on a 3G chip manufactured with 45 nanometer (nm) process technology. The next generation of CMOS semiconductor manufacturing, 45 nm technology enables chips that feature higher speeds, lower power consumption and enhanced integration, all with reduced die cost by providing more die per wafer. Qualcomm’s call was made on the first 45 nm chips received from Taiwan Semiconductor Manufacturing Company, the world’s largest dedicated semiconductor foundry. More at Qualcomm here and here.


Nov 13 2007

Intel’s Experts Explain 45nm Breakthroughs

Nov 12, ‘07 — Bob Duffy post an awesome YouTube video at Intel’s “The Server Room Blog” on Intel’s engineers and architects, Stephen Fischer, Principal Architect, Penryn Microsprocessor; Mark Bohr, Intel Senior Fellow; Kelin Kuhn, 45nm Device Group Leader; Kaizad Mistry, 45nm Program Manager, explaining how Intel got down to 45nm and what’s next after Penryn.

In his words, “Moore’s law has pushed the phyisical limits of the current materials. Intel has used Hafnium based materials allowing for smaller devices without gate leakage. As Kelin Kuhn says, the technology is getting nearly “incomprehensable”.

With 45nm technology we are working on a scale where 400 transistors can fit on the the size of a human bloodcell. Modern processors are allowing for 100’s of millions of working transitors, and devices in the fab are being produced at 1/10th the wavelength of light … truly amazing.” More at The Server Room Blog.


Nov 11 2007

Intel to Enter in to New Era of Transistors Made of Hafnium with Faster, Smaller 45nm Penryn Processors

IntelIntel_Core_2_Extreme_Quad_CoreIntel Co-Founder Gordon_MooreNovember 11, 2007 — Intel plans to roll out its newest generation of processors, Monday, flexing its manufacturing muscle with a sophisticated new process that crams up to 40 percent more transistors onto the Penryn chips.

The world’s largest semiconductor company expects to start shipping 16 new microprocessors — which also boast inventive new materials to stanch electricity loss — for use in servers and high-end gaming PCs .

The chip maker will now use Hafnium in combination with a pair of secret metal oxides instead of silicon dioxide to craft the insulation layer of the gate that controls current. The tweaking of the materials counts as the most significant change to transistors in about forty years, according to Intel co-founder Gordon Moore.

Fifteen of the new chips will run server computers, or systems that dish out data on corporate networks and the Internet, while one model is designed for personal computers.

On Monday, Intel will roll out 12 new quad-core versions of its Xeon server chip available in the Penryn family, which will ship as the Xeon 5400 Series products. The chips will be available at speeds between 2GHz and 3.20GHz with a front side bus topping out at 1600MHz and cache sizes of up to 12MB.

In addition, customers will find the new quad-core Core 2 Extreme QX9650 desktop chip. Next month, Intel will ship three new dual-core versions of Xeon under the 5200 Series brand. 

Intel plans to release three more server models in December, followed by desktop-computer and notebook chips in the first quarter of 2008.

While server chips cost about the same as PC processors to make, they can sell for 10 times as much.

The new chip line, which Intel calls Penryn, is made with so-called 45-nanometer process technology. That means the gaps between the tiny wires in the electronic circuits measure just 45 billionths of a meter. That’s less than twice the width of a common-cold virus.

The chips have 820 million transistors, 40 percent more than existing models, yet are 25 percent smaller. Intel’s first chips, introduced in the early 1970s, had just 2,300 transistors

“It will have a big impact on servers, which have the biggest appetite for performance,” said Intel Vice President David Perlmutter. “It’s a huge deal. It’s marrying a great product with a great technology.”

As per Martin Reynolds, an analyst with Stamford, Connecticut-based Gartner Inc, Advanced Micro is about two years behind Intel in its manufacturing technology.

Next year, Intel will begin rolling out more 45nm chips - “Nehalem” - that rely on a revamped microarchitecture that includes integrated memory controllers and high-speed interconnect.

The server chips will sell for $177 to $1279 in quantities of 1,000. The gaming chip will cost $999 in quantities of 1,000. Intel said all the processors would be available within 45 days. More at Intel.


Nov 09 2007

Peek Inside Intel’s Fab 32, New 45nm Factory

Tag: 45nm, Intel, Processors, TechLuverJack @ 3:36 AM

Intel

It’s no secret that Intel safeguards its multi-billion dollar chip factories and rarely lets anyone outside of the company step foot inside. And well… nothing has changed. But this video is the next best thing. Take a walk through the company’s newest Intel 45nm chip making factory, called “Fab 32” and see how the building is structured and how it operates. Measuring a whopping 1 million square feet, Fab 32 is roughly the size of 17 U.S. football fields. And this fab has started production to eventually churn out millions of Intel’s most advanced 45nm chips built using reinvented transistors. More at Intel PR Chip Shots.


Oct 25 2007

Intel Opens First High-Volume 45nm Microprocessor Manufacturing Factory in Chandler, AZ

Tag: 45nm, Environment, Go Green, Intel, Processors, TechLuverJack @ 10:24 AM

Intel Opens First High-Volume 45nm Microprocessor Manufacturing Factory in Chandler, AZIntel Opens First High-Volume 45nm Microprocessor Manufacturing Factory in Chandler, AZIntel Opens First High-Volume 45nm Microprocessor Manufacturing Factory in Chandler, AZIntel Opens First High-Volume 45nm Microprocessor Manufacturing Factory in Chandler, AZNew $3 Billion Facility to Produce Processors with Intel 45nm Hafnium-based High-k Metal Gate Transistors.

CHANDLER, Ariz., Oct. 25, 2007 – Production of a new generation of microprocessors for PCs, laptops, servers and other computing devices officially began today inside of Intel Corporation’s first high-volume 45 nanometer (nm) manufacturing factory in Chandler, Ariz.

Called “Fab 32,” the $3 billion factory will use Intel’s innovative 45nm process technology based on Intel’s breakthrough in “reinventing” certain areas of the transistors inside its processors to reduce energy leakage. The 45nm transistors use a Hafnium-based high-k material for the gate dielectric and metal materials for the gate, and are so small that more than 2 million can fit on the period at the end of this sentence. Millions of these tiny transistors will make up Intel’s faster, more energy efficient lead- and halogen-free processors for PCs, laptops and servers, as well as ultra low-power processors for mobile Internet and consumer electronic devices, and low-cost PCs. The first of the company’s 45nm processors is scheduled to be introduced on Nov. 12.

“The opening of Fab 32 in Arizona today is a testament to Intel’s continued investment in our most strategic asset — the most advanced, environmentally friendly manufacturing network in the world,” said Paul Otellini, Intel president and CEO. “The magic of 45nm and our new transistor design allow us to deliver high-performance, energy-efficient processors to our customers across the entire spectrum of market segments, from the most powerful servers to a variety of mobile devices and everything in between.”

Fab 32 is Intel’s sixth 300mm wafer factory and its second factory to produce 45nm chips. Intel first produced 45nm processors in its Oregon development facility, called D1D, in January and is now moving into high-volume production with the opening of Fab 32. Two additional 45nm, 300mm manufacturing factories are scheduled to open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x). Using 300mm wafers lowers the production cost per chip while diminishing overall use of resources.

With 184,000 square feet of clean room space, the completed Fab 32 structure measures 1 million square feet, so large that more than 17 U.S. football fields could fit inside the building. More than 1,000 employees will operate the factory in such positions as process, automation and yield engineers and senior manufacturing technicians.

A Focus on the Environment – From the Factory Down to the Transistor
Fab 32 will be among Intel’s most environmentally friendly factories, incorporating a number of energy and water conservation measures that have come to characterize Intel’s long track record of environmental stewardship in its operations.

Intel’s industry-leading 45nm process results in a 15 percent reduction in global warming emissions, and Fab 32 makes use of Intel Arizona’s innovative water conservation and reuse program which conserves more than 70 percent of the water.

More at Intel