Taipei, Taiwan — On Dec 17, Micro-Star International (MSI) announced that it has already prepared P7N Diamond and P7N SLI Platinum mainboards to support the 45nm Intel processor at the same time when new nForce chipset launches.
P7N Diamond utilizes nForce780i chipset together with top performance specifications and supports 3-way SLI technology. While, P7N SLI Platinum utilizes nForce750i chipset, making this mainboard cost-effective.
Highly Efficient Circu-Pipe and GreenPower Design
The use of selected high-grade components is the common characteristic of the P7N series mainboards. Although the two mainboards have different market segments, they both come with MSI’s exclusive Circu-Pipe design. Circu-pipe can effectively reduce the high temperature from the chipset and MOSFET.
Selected high-quality solid capacitors and POSCAP!
The all capacitors on these two mainboards are high-quality solid capacitors that are made in Japan. These capacitors with low impedance and high ripple current and other characteristics provide better filtering effect. To further highlight P7N Diamond products, the PWM capacitors on this mainboard are based on POSCAP. POSCAP (Polymerized Organic Semiconductor Capacitor) is a high grade product recently developed by Sanyo.
45nm Processor and 3-way SLI ready!
P7N series mainboards are Intel 45nm processor and 3-way SLI ready. The 45nm Quad Core CPU support brings more benefits to multimedia and multitasking by enhancing the performance and reducing the waiting time for any kind of applications. It provides extremely high definition audio/video stream editing and offers higher performance on 3D gaming and professional graphic rendering.
MSI design quad PCI-E VGA slot on P7N Diamond for more than the new Nvidia 3-way SLI technology, also comes with PCI-E Gen2 to offer wider bandwidth. This will bring higher 3D gaming resolutions with more detail DX10 effects. More at Micro-Star International.
Next-generation HDTVs to use 4.8Gbps XDR DRAM
LOS ALTOS, Calif — Dec 17, `07 –BUSINESS WIRE– Rambus today announced that Toshiba Corporation has licensed its XDR memory controller interface cell (XIO) and XDR memory controller (XMC) for next-generation high-definition television (HDTV) chipsets. The XIO and XMC will be implemented in Toshiba’s 65nm process. Operating at 4.8Gbps, the XDR memory architecture will allow Toshiba’s HDTV chipset to deliver state-of-the-art image processing performance in its customers’ HDTVs.
The XDR memory architecture uses patented Rambus innovations such as Octal Data Rate (ODR) technology, Differential Rambus Signaling Level (DRSL), and FlexPhase circuits to deliver the highest bandwidth available while using fewer DRAM devices than industry-standard memory solutions. Higher memory performance as delivered by the XDR architecture enables the advanced features of next-generation HDTVs such as 1080p+ resolution, 120Hz refresh rates, 12-bit color, multiple full HD Picture-in-Picture (PiP) data streams, and advanced image enhancement algorithms.More here.
Taipei, Taiwan — Dec 17, `07 — DigiTimes is reporting on Intel delaying the launch of its X48 Chipset by 1-2 months because one of the first-tier motherboard makers still holds a large volume of X38 chipset inventory, citing sources at motherboard makers.
DigiTimes further reports, “The motherboard maker fears that the X48 chipset will slow down clearance of its X38 chipset inventory and has negotiated with Intel to delay the launch of its X48 chipset. However the delay is expected to hurt makers who do not have an overstock X38 chipsets.” More at DigiTimes.
Still Q1-08 launch seems very likely as Intel confirms the X48 Chipset launch along with Core 2 Extreme QX9770 processor in Q1 of next year in its ‘News Fact Sheet’ dated Dec 14, `07.
“• In the first quarter of 2008, Intel will continue its progression of leading-edge technology products:
- The Intel Core 2 Extreme QX9770 Processor (3.2 GHz/1600 MHz system bus 45nm Hi-k metal gate processor formerly codenamed “Yorkfield”) and Intel X48 Express Chipset targeted at high-end PC users and enthusiasts. The Intel X48 Express Chipset continues to push the performance envelope with native support for XMP 1600 DDR3 memory.” More at Intel (in pdf).
Espoo, Finland and Geneva, Switzerland — Nov 05, ‘07 — Nokia and STMicroelectronics today announced the closing of their deal, announced on August 8th, to deepen their collaboration on the licensing and supply of integrated circuit designs and modem technologies for 3G and its evolution.
The closing of the multifaceted agreement transfers a core part of Nokia’s Integrated Circuit (IC) operations to STMicroelectronics and positions ST to design and manufacture 3G chipsets based on Nokia’s modem technologies, energy management and RF (radio frequency) technology and to deliver complete solutions to Nokia and the open market. The agreement includes the transfer of approximately 185 highly-skilled engineers and other Nokia personnel in Finland and UK to STMicroelectronics. The transfer has been subject to a personnel consultation process required by local regulations
As part of the arrangement, Nokia has awarded ST a design win of an advanced 3G HSPA (high-speed packet access) chipset supporting high data rates. This design win represents ST’s first complete 3G chipset.
