New Low-power QSC Solutions Offer Latest Modem Technologies, Multi-band Transceiver, High-performance Application Processor, Bluetooth, FM Radio and GPS in a 12mm x 12mm Package.
SAN DIEGO — November 13, 2007 — Qualcomm today introduced three new 45 nm single-chip solutions designed to enable mass-market smartphones with an unsurpassed range of capabilities. The QSC7230 for HSPA+ devices, QSC7830 for CDMA2000 1xEV-DO Rev. B devices, and multi-mode QSC7630 for both HSPA+ and EV-DO Rev. B, all feature the highest levels of integration in the wireless industry today and deliver support for third-party operating systems. These three single-chip solutions are the fifth generation of dual-core solutions from Qualcomm, comprising the next evolution of the Company’s MSM7xxx-series dual-core chipsets.
The products offer the most advanced cellular modem technologies, a multi-band RF transceiver supporting all frequency bands worldwide, an ARM11 application processor running up to 600 MHz, Bluetooth 2.1 EDR, FM radio and GPS - all in a single 12×12 package. Additionally, the three chipsets feature new power-saving innovations to deliver more than 80 hours of music playback, a full day of talk time, and more than a month of standby time.
The QSC7230 supports UMTS Release 7 (HSPA+) and Cat. 9 UMTS for 10.2 Mbps HSDPA and 5.76 Mbps HSUPA data speeds. The QSC7830 supports EV-DO Rev. B for up to 14.7 Mbps on the downlink and 5.4 Mbps on the uplink. The QSC7630 supports both EV-DO Rev. B and HSPA+. All three products feature full backward compatibility to previous-generation networks, as well as:
· ARM11 applications processor running at up to 600MHz
· Support for 5 megapixel camera, VGA display resolution and TV-out
· Support for third-party operating systems such as Windows Mobile and Linux
· 45 nm CMOS process technology
· 2D and 3D hardware-accelerated graphics
· Fully integrated GPS, FM radio and Bluetooth, eliminating the need for many external components
· Integrated support for worldwide cellular frequency bands
- For CDMA2000: 450MHz, 700MHz, 800MHz, J-800MHz, 850MHz, 1500MHz, AWS, KPCS 1.8GHz, 1.9GHz, 2.1GHz, 2.5GHz
- For UMTS: 700MHz, 800MHz, 850MHz, 900MHz, 1500MHz, AWS, 1800MHz, 1900MHz, 2.1MHz, 2.6GHz
- 4-band EGPRS support in 900MHz, 1800MHz, 850MHz, 1900MHz
· 12mm x 12mm package size
The QSC solutions are scheduled to sample in the fourth quarter of 2008.
Qualcomm Makes First Call with Chips Using TSMC’s 45 nm Technology
Qualcomm today also announced that it has made the first phone call on a 3G chip manufactured with 45 nanometer (nm) process technology. The next generation of CMOS semiconductor manufacturing, 45 nm technology enables chips that feature higher speeds, lower power consumption and enhanced integration, all with reduced die cost by providing more die per wafer. Qualcomm’s call was made on the first 45 nm chips received from Taiwan Semiconductor Manufacturing Company, the world’s largest dedicated semiconductor foundry. More at Qualcomm here and here.